Odisha Takes a Giant Leap in Semiconductor Technology with New 3D Glass Chip Facility

Odisha has taken a monumental step in the semiconductor industry with the groundbreaking of India's first advanced 3D glass chip packaging unit in Bhubaneswar. Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw led the ceremony, emphasizing the project's potential to create thousands of jobs and position Odisha as a leader in advanced electronics manufacturing. This facility will utilize cutting-edge technology and is expected to serve critical sectors such as aerospace and AI. The project, with an investment of approximately Rs 1,943 crore, marks a significant advancement in India's semiconductor journey.

By Narendra Chaudhary Apr 19, 2026, 15:15 IST

Groundbreaking Ceremony for India's First Advanced 3D Glass Chip Packaging Unit

Bhubaneswar: The Chief Minister of Odisha, Mohan Charan Majhi, alongside Union Minister Ashwini Vaishnaw, inaugurated the groundbreaking ceremony for India's inaugural advanced 3D glass chip packaging facility in Bhubaneswar on Sunday.

During the ceremony, both leaders laid the foundation stone for this significant project.

In a post on social media, Majhi highlighted the rapid transformation of Odisha's industrial sector, which is now embracing technology and high-value manufacturing beyond traditional industries.

He remarked, "Today signifies a pivotal moment as we commence work on India's first advanced 3D glass chip packaging unit. This innovative project is set to create substantial job opportunities and position Odisha as a key player in advanced electronics manufacturing."

The Chief Minister emphasized Odisha's commitment to becoming a center for next-generation industries, contributing to the vision of an 'Atmanirbhar Bharat'.

Majhi expressed his excitement, stating, "From the land of Odisha, India has taken a crucial step in its semiconductor journey. I was thrilled to join Hon'ble Union Minister Shri @AshwiniVaishnaw Ji for this groundbreaking ceremony, marking a historic milestone that places Odisha at the forefront of global electronics manufacturing and AI development."

He further added, "This investment is not just industrial; it signifies where future technologies will be developed, showcasing the impact of responsive governance and strategic foresight for our citizens."

An official stated that this project introduces the most advanced chip packaging technology to India, positioning Odisha as a leader in next-generation semiconductor advancements.

This facility will be the first in India to utilize glass substrate-based advanced semiconductor packaging, employing advanced 3D heterogeneous integration modules.

The central government has approved the project with an estimated budget of around Rs 1,943 crore, which is expected to create approximately 2,500 direct and indirect jobs, with an annual production capacity of 50 million assembled units.

The chips manufactured in Odisha will cater to critical sectors such as aerospace, defense, artificial intelligence, 5G technologies, and data centers.

The event was attended by State Electronics & IT Minister Mukesh Mahaling, Union IT Secretary S Krishnan, and Chief Secretary Anu Garg, among others.